This week Qualcomm Incorporated announced its new Gobi baby, the Gobi 4000 chipset for 4G LTE and HSPA+ enabled devices. This latest chip is expected to be used for the next generation LTE iPad, as Apple already admitted testing the new generation of LTE iPad. It seems obvious then that Apple will repeat history and go for Qualcomm chips again.
The company’s release statement said that the Gobi 4000 platform will allow costumers the possibility of offering LTE/HSPA+ and LTE/EV-DO designs, in response to the large demand of embedded 3G/4G connectivity in mobile devices we are witnessing today. System designers can now choose between an embedded Gobi 400 platform for high-speed 4G LTE support or an embedded Gobi 3000 platform for worldwide 3G connectivity.
The new chips are based on Qualcomm’s MDM9600 and MDM 9200 3G/4G wireless modems, and have been specifically engineered for deployment in devices with the help of Snapdragon dual-core and quad-core processors. What’s more the Gobi 4000 platform is also backwards compatible with HSPA and EV-DO.
It’s easy to see why system designers like Apple will appreciate Qualcomm’s diverse chipsets, while having the opportunity to choose between and embedded Gobi 400 platform to give their devices high-speed 4F LTE support or a Gobi 3000 platform for worldwide 3G connectivity using a single chip. This will most likely enhance power efficiency a thing Apple is looking to work on.
Qualcomm Incorporated is the world leader in 3G and next-generation mobile technologies. Working tirelessly for more than 25 years, Qualcomm ideas and invention helped to make the evolution of digital communication possible. These innovations secured the bond between people and information or entertainment in the entire world.